Ultrasonic PTMS Electromagnetic Separator iron removal technology handles natural silicon sand containing thin film iron with short time and high efficiency
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Ultrasonic PTMS Electromagnetic Separator iron removal is mainly to remove the secondary iron film (that is, the film iron). The iron film binds strongly and cannot be separated by the mechanical scrubbing method used in mineral processing. The treatment of natural silica sand containing thin film iron by ultrasonic technology has the characteristics of short time and high efficiency. However, in the use of ultrasonic iron removal, attention should be paid to the timely removal of waste liquid, to prevent secondary adhesion and reduce the effect of iron removal.
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If ultrasonic cleaning is combined with chemical agents (dispersant), the iron removal rate can be increased by 15-30%. However, for the cheap resource of silicon sand, ultrasonic PTMS Electromagnetic Separator iron removal is still relatively expensive at present, and it is still difficult to apply in large concentrators, but it is possible to apply in those production fields requiring high purity and low consumption.
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In the electronics industry, PTMS Electromagnetic Separator iron removal quartz sand is mainly used in chip manufacturing, electronic components packaging and other high-end fields. In chip manufacturing, high-purity quartz sand is used to make silicon wafers, which is the basic material for integrated circuits. In electronic components packaging, quartz sand is also used to manufacture some packaging materials with special performance requirements.
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